Paper Title:
Lapping Process of Diamond Cutting Tool by Molecular Dynamics Simulating
  Abstract

Molecular dynamics is a rapidly developing field of science and has become an established tool for studying the dynamic behavior of material machining. A three-dimensional molecular dynamics (MD) model about the atoms of the diamond cutting tools and the diamond grits is built by using the molecular dynamics. The Tersoff potential function is used to calculate the force and potential energy among the atoms of the diamond tools and the atoms of the diamond grits. The lapping processes at a special cutting depth are simulated. The variety of the specimen potential energy in the lapping process is observed. The mechanism of the diamond micro machining and the form of the surface formation are given by comparing the distribution maps of atoms in initial and cutting states. This study will give a strong support to the diamond cutting tools’ lapping.

  Info
Periodical
Key Engineering Materials (Volumes 359-360)
Edited by
Jiuhua Xu, Xipeng Xu, Guangqi Cai and Renke Kang
Pages
249-253
DOI
10.4028/www.scientific.net/KEM.359-360.249
Citation
Z. Q. Li, T. Sun, Y. D. Yan, J. J. Zhang, Y. C. Liang, S. Dong, "Lapping Process of Diamond Cutting Tool by Molecular Dynamics Simulating", Key Engineering Materials, Vols. 359-360, pp. 249-253, 2008
Online since
November 2007
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Price
$32.00
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