The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer |
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| Journal | Key Engineering Materials (Volumes 359 - 360) |
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| Volume | Advances in Grinding and Abrasive Technology XIV |
| Edited by | Jiuhua Xu, Xipeng Xu, Guangqi Cai and Renke Kang |
| Pages | 324-328 |
| DOI | 10.4028/www.scientific.net/KEM.359-360.324 |
| Citation | Wei Li et al., 2007, Key Engineering Materials, 359-360, 324 |
| Online since | November, 2007 |
| Authors | Wei Li, Gang Xiang Hu, Xiao Dong Hu, Xiao Zhen Hu |
| Keywords | Double Sided Polishing, Optimization, Silicon Wafer, Slurry |
| Abstract | This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished surface of silicon wafer has been got with higher efficient. |
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