Paper Title:
The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer
  Abstract

This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished surface of silicon wafer has been got with higher efficient.

  Info
Periodical
Key Engineering Materials (Volumes 359-360)
Edited by
Jiuhua Xu, Xipeng Xu, Guangqi Cai and Renke Kang
Pages
324-328
DOI
10.4028/www.scientific.net/KEM.359-360.324
Citation
W. Li, G. X. Hu, X. D. Hu, X. Z. Hu, "The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer ", Key Engineering Materials, Vols. 359-360, pp. 324-328, 2008
Online since
November 2007
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Price
$32.00
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