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Advances in Grinding and Abrasive Technology XIV

Key Engineering Materials Volumes 359 - 360

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• p290 Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid   [ 208 K ]
  Authors: Jian Ming Zhan, Di Zheng
• p295 Study of Finishing Internal Surface Using Magnetic Force Generated by Rotating Magnetic Field in Electromotor   [ 741 K ]
  Authors: Xin Gai Yao, Shi Ying Wang, Yan Hong Ding, Gang Ya, Jie Zhang
• p300 Experimental Study on Increasing Magnetic Abrasive Finishing Efficiency of Finishing Nonferromagnetic Materials   [ 155 K ]
  Authors: Shu Ren Zhang, Li Feng Yang, Guo Xiang Wu
• p305 Optimize Parameters of Floating Polishing with Tri-Polishing-Disk   [ 156 K ]
  Authors: Xiao Cun Xu, Zhe Jun Yuan, Bing Lin
• p309 Study on Pad Conditioning Parameters in Silicon Wafer CMP Process   [ 190 K ]
  Authors: Zhao Zhong Zhou, Ju Long Yuan, Bing Hai Lv, Jia Jin Zheng
• p314 Technique Optimization of Dual Rotation Plates Lapping Method for Ceramic Ball   [ 272 K ]
  Authors: Xun Lv, Ju Long Yuan, Yong Dai
• p319 Study on the Surface Integrity of Polished Diamond Thick Film Prepared by EACVD   [ 738 K ]
  Authors: Feng Xu, Dun Wen Zuo, Rong Fa Chen, Wen Zhuang Lu, Min Wang
• p324 The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer   [ 250 K ]
  Authors: Wei Li, Gang Xiang Hu, Xiao Dong Hu, Xiao Zhen Hu
• p329 New Thought for Designing the Multi-Phase and Multi-Scale Nanocomposite Ceramic Tool Materials   [ 178 K ]
  Authors: Han Lian Liu, Chuan Zhen Huang, Xin Ying Teng, Hui Wang
• p335 Crown Modification of Cylinder-Roller Bearing Raceway Using Electrochemical Abrasive Belt Grinding   [ 378 K ]
  Authors: Wen Ji Xu, Bin Tao, Gui Bing Pang, Xu Yue Wang, Xiao Hui Zhao
• p340 Surface Texturing Technology by Laser Honing Based on Hydrodynamic Lubrication   [ 286 K ]
  Authors: Yong Kang Zhang, Chao Jun Yang, Yong Hong Fu, Jian Zhong Zhou, Xin Jun Hua, Jing Hu Ji
• p344 Research on Micro-Mechanism of Nanocomposite Ceramic in Two-Dimensional Ultrasound Grinding   [ 367 K ]
  Authors: Bo Zhao, Yan Wu, Guo Fu Gao, Feng Jiao
• p349 Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films   [ 3 M ]
  Authors: Cong Rong Zhu, Qin Xu, Ju Long Yuan, Dong Hui Wen, Bing Hai Lv
• p355 Influences of Ultrasonic Assistance in High Speed Lapping of Nano ZTA Engineering Ceramic on the Surface Machining Quality   [ 428 K ]
  Authors: Feng Jiao, Bo Zhao, Chuan Shao Liu, Xun Sheng Zhu
• p360 Electrochemical Grinding for Unclosed Internal Cylinder Surface   [ 236 K ]
  Authors: Ping Mei Ming, Di Zhu, Zheng Yang Xu