Paper Title:
Microtensile Bond Strength of Dual-Cured Resin Luting Cements to Dentin by the Type of Dentin Adhesives
  Abstract

This study was performed to investigate the bond strength between 4 dentin adhesives and resin luting cements by means of μTBS test. The materials used in this study were four resin cements (Choice, Panavia F, RelyX ARC, Bistite II DC), one 3-step adhesive (All-Bond2), one 2- step self-etching adhesive (Clearfil SE-Bond) and two 1-step self-etching adhesives(Prompt L-Pop and One-Up Bond F). Combination of 4 different dentin adhesives with 4 resin cements made up 16 experimental groups. Extracted human mandibular third molars without caries and restoratives were stored in saline and used within 1 month of extraction. All adhesive systems and resin cements were manipulated and applied to the dentin surfaces according to the manufactures’ instructions. The resin composite “overlays” prepared with 6 mm thickness (Tescera, Bisco Inc., Schaumburg, IL, USA) were luted with each resin cement. Each sample was measured μTBS. 1-step self-etching adhesives coupled with all resin luting cements used in this study resulted in lower bond strength except of OU-PA group. When Choice, RelyX ARC and Bistite II were used, Clearfil SE-Bond showed significantly higher μTBS values than 1-step self-etching adhesives (p<0.05). Clearfil SE-Bond did not show significant μTBS values than All-Bond 2 that is conventional 3-step dentin adhesive (p>0.05).

  Info
Periodical
Key Engineering Materials (Volumes 361-363)
Main Theme
Edited by
Guy Daculsi and Pierre Layrolle
Pages
889-892
DOI
10.4028/www.scientific.net/KEM.361-363.889
Citation
S.Y. Kim, D.W. Kim, S.H. Park, K.K. Choi, "Microtensile Bond Strength of Dual-Cured Resin Luting Cements to Dentin by the Type of Dentin Adhesives", Key Engineering Materials, Vols. 361-363, pp. 889-892, 2008
Online since
November 2007
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Abstract:Dental resin composite cements were prepared with simply mixing method of Part A and Part B. The material components in Part A were composed...
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