Package for Side Emitting LED |
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| Journal | Key Engineering Materials (Volumes 364 - 366) |
|---|---|
| Volume | Optics Design and Precision Manufacturing Technologies |
| Edited by | Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO |
| Pages | 148-151 |
| DOI | 10.4028/www.scientific.net/KEM.364-366.148 |
| Citation | Yu Nan Pao et al., 2007, Key Engineering Materials, 364-366, 148 |
| Online since | December, 2007 |
| Authors | Yu Nan Pao, Po Hung Yao, Yi Ting Sun, Chung Hao Tien |
| Keywords | Backlight, Collimation, Reflection, Side-Emitting Package |
| Abstract | A wide angle light-deflected lens combining collimation and total internal reflection (TIR) optical mechanics for LED package is proposed. Utilizing angle-dividing method the angle of emitting distribution of LED chip was cut into several angular zones and then a light-collimating curve surface with corresponding declined plane performing TIR for the collimated incident ray was designed. Thereby, the light-deflected lens, consisting of multi pairs of collimating curve surfaces and declined planes, can achieve wide-angle deflection of light emitting from LED chip. The design rule and experiment results of the lens with optimization optical design are demonstrated and discussed in this paper. |
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