Paper Title:
A Study of the Microstructure and Properties of Electroformed Ni-P Model Insert
  Abstract

In this study, a Ni-P alloy electroforming nanostructure material with low surface roughness and low internal stress was developed by using a pulse current. Square-wave cathodic current modulation was employed to electrodeposit ultrafine-grained Ni-P films from an additivefree Sulfamate nickel bath. The effect of various factors, such as peak current density, duty cycle and pulse frequency on the roughness and internal stress were investigated. Pulse current significantly influences the microstructure of Ni-P alloys. The internal stress and roughness of Ni-P alloys increased as peak current density increased, but the internal stress of Ni-P alloys decreased as duty cycle decreased.

  Info
Periodical
Key Engineering Materials (Volumes 364-366)
Edited by
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
Pages
232-236
DOI
10.4028/www.scientific.net/KEM.364-366.232
Citation
S. T. Ke, J. L. Lee, Y. M. Yeh, S. J. Lee, M. D. Ger, "A Study of the Microstructure and Properties of Electroformed Ni-P Model Insert", Key Engineering Materials, Vols. 364-366, pp. 232-236, 2008
Online since
December 2007
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$32.00
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