Paper Title:
The Integrated Packaging Process for Optical Sensor and RFID Used in Harsh Environment Conditions
  Abstract

Many technologies, such as Radio Frequency Identification (RFID), have been developed to keep pace with rapid changes in society. Additionally, an RFID tag can be integrated with a sensor or actuator (a smart RFID), they can comprise a sensitive wireless network. The potential and utility of smart RFID techniques have increased dramatically. However, based on the distinctive characteristics of RFID and sensors/actuators, they cannot be combined simultaneously using commercial RFID techniques and materials such as poly phenylene sulfide (PPS). Conversely, smart RFID systems will be exposed to harsh environments, including temperature variations, salt corrosion, and violent impact. The current polymeric RFID packaging technique cannot withstand severe environmental conditions for a long period. This study presents a novel integrated packaging technique for sensors and RFID that is fully compatible with the complementary metal-oxide-semiconductor (CMOS) processes to identify the limitations of traditional RFID packaging methods. After several tests in harsh environments, such as strength, corrosion resistance, thermal stress, and simulated washing, the RFID and sensor operated normally. Therefore, the novel encapsulation process for RFID integrated with a sensor overcomes the bottleneck of conventional RFID packaging techniques. The potential of this novel technique is significant and provides a new approach as it achieves high performance and at a low cost. Furthermore, the proposed new technique should prove very useful in applications as smart RFID areas.

  Info
Periodical
Key Engineering Materials (Volumes 364-366)
Edited by
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
Pages
419-424
DOI
10.4028/www.scientific.net/KEM.364-366.419
Citation
C. W. Wu, Y. K. Shen, C. U. Lee, C. S. Wei, C. C. Hsiao, "The Integrated Packaging Process for Optical Sensor and RFID Used in Harsh Environment Conditions", Key Engineering Materials, Vols. 364-366, pp. 419-424, 2008
Online since
December 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: K. Dynefors, V. Desmaris, Joakim Eriksson, Per Åke Nilsson, Niklas Rorsman, Herbert Zirath
1125
Authors: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
Abstract:Ball shear test was investigated in terms of effects of important test parameters, i.e. shear height and shear speed, with an experimental...
851
Authors: Chang Long Liu, Da Pei Tang
Abstract:Thermal residual stress in diamond film deposited onto Mo substrate was simulated and analyzed comprehensively by using the finite element...
1199
Authors: Xin Chun Guan, Hui Li, Hui Gang Xiao, Guo Fu Qiao, Jin Ping Ou
Chapter 1: Smart Materials, Sensors, Actuators, MEMS
Abstract:In this paper, some smart sensors or material used to make the smart sensors, such as piezoresistance composite, piezoelectric polymer,...
9
Authors: C.D. Matthus, Tobias Erlbacher, Alexander Burenkov, Anton J. Bauer, Lothar Frey
4.5 Other Devices (Sensors, Detectors, ...)
Abstract:This paper describes the fabrication, characterization, and simulation of 4H-SiC pin-photodiodes for solar UV radiation detection. The...
1032