Paper Title:
A Study of Process Parameter Optimization for Passive Component Precision Extrusion
  Abstract

Chips scraping each other during transportation, and chips coming into contact with water or air will cause oxidization resulting in poor quality products. The chips need to be well packed and to be protected from the environment. The method of Surface Mount Component (SMC) packing using plastic carrier tape can reduce chip damage. This study focuses on the extrusion process parameters optimization of plastic carrier tape. Because each extrusion process produces 270 pieces of carrier tape, the tape size is 1.35mmX2.25mmX1.35mm and is extremely difficult to reach the tolerance standard. This study utilized a practical test to explore various factors on the quality of the carrier tape, such as the rotational speed of extruder screw motor and extrusion mold; the negative pressure of extrusion mold; and the temperature of the extrusion mold. These experiments could find out an optimal extrusion process.

  Info
Periodical
Key Engineering Materials (Volumes 364-366)
Edited by
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
Pages
634-639
DOI
10.4028/www.scientific.net/KEM.364-366.634
Citation
W. S. Lin, K. S. Lee, S. M. Huang, R. Y. Jou, J. C. Lin, "A Study of Process Parameter Optimization for Passive Component Precision Extrusion ", Key Engineering Materials, Vols. 364-366, pp. 634-639, 2008
Online since
December 2007
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Price
$32.00
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