Paper Title:
Method of Examining Surface Cracks on Monocrystalline Silicon
  Abstract

A new method on examining the micro cracks of monocrystalline silicon during nano indentation is proposed. It is established based on a study of the increasing rate of absorbed energy in nano indentation. This method provides a simple approach in understanding whether cracks on the silicon surfaces occur, while it is tedious in conventional method.

  Info
Periodical
Key Engineering Materials (Volumes 364-366)
Edited by
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
Pages
920-924
DOI
10.4028/www.scientific.net/KEM.364-366.920
Citation
F. Z. Fang, Y. C. Liu, Q. X. Pei, X. T. Hu, "Method of Examining Surface Cracks on Monocrystalline Silicon", Key Engineering Materials, Vols. 364-366, pp. 920-924, 2008
Online since
December 2007
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$32.00
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