Paper Title:
Nano Molding Technology for Optical Storage Media with Large-Area Nano-Pattern

Nano hot or thermal embossing has many advantages of comparatively few process steps, simple operation, relatively low tooling cost and high replication accuracy for small features. However, because of its long processing time, it has been known as being less competitive than nano injection molding. In order to overcome the weakness of long processing time, the high speed nano hot embossing system has been developed and its characteristics were investigated. Nanopatterned stampers made of Ni and Si were fabricated by the laser mastering and electroforming process and the DRIE and LPCVD or thermal oxidation process respectively. In order to make the processing time shorter and get relatively higher aspect ratio nano/micro features, especially, the temperatures of the molds were controlled actively and precisely during the embossing process. Through various experiments, nano embossing parameters, such as temperature, pressure and processing time, are optimized and the high aspect ratio nano features could be obtained.

Key Engineering Materials (Volumes 364-366)
Edited by
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
H. G. Shin, H. Y. Kim, B. H. Kim, "Nano Molding Technology for Optical Storage Media with Large-Area Nano-Pattern", Key Engineering Materials, Vols. 364-366, pp. 925-930, Dec. 2007
Online since
December 2007
US$ 28,-
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