Paper Title:
Thermal Conductivities of β-Si3N4 and BN-Filled Epoxy Molding Compounds (EMC)
  Abstract

New electric molding composites were fabricated with hybridizing epoxy and several fillers. The examined fillers were β-Si3N4, BN and fused silica or their combinations. The thermal conductivity of β-Si3N4 filler was compared with BN as filler for advanced epoxy molding compounds. The influence of pure resin matrix and mixture matrix on the thermal conductivity of EMC was discussed. The results were explained with Maxwell equation.

  Info
Periodical
Key Engineering Materials (Volumes 368-372)
Edited by
Wei Pan and Jianghong Gong
Pages
1071-1073
DOI
10.4028/www.scientific.net/KEM.368-372.1071
Citation
Z. Yuan, K. X. Chen, "Thermal Conductivities of β-Si3N4 and BN-Filled Epoxy Molding Compounds (EMC)", Key Engineering Materials, Vols. 368-372, pp. 1071-1073, 2008
Online since
February 2008
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$32.00
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