Pulse current heating technology is used to join TiB2-Ni cermets with Ti6Al4V at different temperatures (1023K, 1073K and 1123K) with 7MPa pressure and Cu foil and Ni foil are used as joining interlayer. Joint points increase with welding temperature. The microstructure of joints is observed through SEM images and micrographs. The diffusion coefficient (D0) of Cu at the Cu/TiB2 interface is calculated by the EPMA patterns. The diffusion principle of pulse current heating and influences of electric field and current on atom diffusion are studied.