Paper Title:
The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field
  Abstract

The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate that, without high magnetic field, the growth behaviors of these two IMC layers are similar in the aging except the initial morphologies. However, the morphologies and crystal orientations of these two IMC layers have changed after being aged in high magnetic field.

  Info
Periodical
Key Engineering Materials (Volumes 373-374)
Main Theme
Edited by
M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu
Pages
480-483
DOI
10.4028/www.scientific.net/KEM.373-374.480
Citation
C. Q. Cheng, J. Zhao, Y. Xu, P. Yang, "The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field", Key Engineering Materials, Vols. 373-374, pp. 480-483, 2008
Online since
March 2008
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