Paper Title:
Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering
  Abstract

The microstructure evolution and the growth behavior of intermetallic compounds (IMCs) at Sn-xZn-2Cu/Cu (x=6.5, 8.8, 10 and 12, wt%) interfaces during soldering were investigated. The results indicate that planar Cu5Zn8 layer is formed at each interface of Sn-8.8Zn-2Cu/Cu, Sn-10Zn- 2Cu/Cu and Sn-12Zn-2Cu/Cu couples for all soldering time. However, for Sn-6.5Zn-2Cu/Cu couple, it is Cu5Zn8 phase that formed at the interface within shorter soldering time (1 h and 4 h), but the interfacial reaction products become a double layer structure of Cu6Sn5 phase (near Cu substrate) and CuZn phase (near solder) for longer soldering time (25 h and 49 h). The thickness of IMC layers in all couples increases exponentially with the soldering time. It is also found that for the same soldering time, the thickness of IMC layers increases with increasing Zn content in the solder.

  Info
Periodical
Key Engineering Materials (Volumes 373-374)
Main Theme
Edited by
M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu
Pages
543-546
DOI
10.4028/www.scientific.net/KEM.373-374.543
Citation
N. Zhao, J. H. Wang, H. T. Ma, L. Wang, "Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering", Key Engineering Materials, Vols. 373-374, pp. 543-546, 2008
Online since
March 2008
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$32.00
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