Progress of Research in Slicing Technology of Large-Scale Silicon Wafers |
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| Journal | Key Engineering Materials (Volumes 375 - 376) |
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| Volume | Advances in Machining & Manufacturing Technology IX |
| Edited by | Yingxue Yao, Xipeng Xu and Dunwen Zuo |
| Pages | 1-5 |
| DOI | 10.4028/www.scientific.net/KEM.375-376.1 |
| Citation | Li Gang Zhao et al., 2008, Key Engineering Materials, 375-376, 1 |
| Online since | March, 2008 |
| Authors | Li Gang Zhao, Dun Wen Zuo, Yu Li Sun |
| Keywords | Fixed Abrasive Multi-Wire Saw, Free Abrasive Multi-Wire Saw, ID Slicing, Silicon Wafer, WEDM |
| Abstract | This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development. |
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