Progress of Research in Slicing Technology of Large-Scale Silicon Wafers |
| Journal |
Key Engineering Materials (Volumes 375 - 376) |
| Volume |
Advances in Machining & Manufacturing Technology IX |
| Edited by |
Yingxue Yao, Xipeng Xu and Dunwen Zuo |
| Pages |
1-5 |
| DOI |
10.4028/www.scientific.net/KEM.375-376.1 |
| Online since |
March, 2008 |
| Authors |
Li Gang Zhao,
Dun Wen Zuo,
Yu Li Sun
|
| Keywords |
Fixed Abrasive Multi-Wire Saw, Free Abrasive Multi-Wire Saw, ID Slicing, Silicon Wafer, WEDM |
| Abstract |
This paper introduces and summarizes the slicing technology of large-scare silicon
wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally,
this document indicates the direction of research and the development. |
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