Paper Title:
Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
  Abstract

This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

  Info
Periodical
Key Engineering Materials (Volumes 375-376)
Edited by
Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages
1-5
DOI
10.4028/www.scientific.net/KEM.375-376.1
Citation
L. G. Zhao, D. W. Zuo, Y. L. Sun, "Progress of Research in Slicing Technology of Large-Scale Silicon Wafers", Key Engineering Materials, Vols. 375-376, pp. 1-5, 2008
Online since
March 2008
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hiroki Nakamura, Ji Wang Yan, Katsuo Syoji, Y. Wakamatsu
257
Authors: Pei Qi Ge, Zhi Jian Hou, Shao Jie Li
Abstract:Because its advantages of lower manufacture cost and higher slicing quality, the resin bonded diamond wire saw is supposed to be used widely...
321
Authors: Ya Dong Gong, Yue Ming Liu, Jun Cheng, J.F. Zhang
Abstract:Grinding characteristics brought by the grinding speed reduction and geometrical model differences between micro-grinding and conventional...
6
Authors: Qian Fa Deng, Ping Zhao, Bing Hai Lv, Ju Long Yuan, Zhi Wei Wang
Chapter 1: Grinding Technology
Abstract:Abrasive machining is an important process for the manufacturing of advanced ceramics. The demand for advanced ceramics with better quality...
251
Authors: Wen Bo Bi, Pei Qi Ge, Yu Fei Gao, Zhen Jie Zhu
Chapter 10: Manufacturing Processes and Technologies
Abstract:This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of...
1694