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Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

Journal Key Engineering Materials (Volumes 375 - 376)
Volume Advances in Machining & Manufacturing Technology IX
Edited by Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages 1-5
DOI 10.4028/www.scientific.net/KEM.375-376.1
Citation Li Gang Zhao et al., 2008, Key Engineering Materials, 375-376, 1
Online since March, 2008
Authors Li Gang Zhao, Dun Wen Zuo, Yu Li Sun
Keywords Fixed Abrasive Multi-Wire Saw, Free Abrasive Multi-Wire Saw, ID Slicing, Silicon Wafer, WEDM
Abstract

This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

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