Paper Title:
Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon
  Abstract

According to the size effect theory established on the concept of geometrically necessary dislocations and results of nano-indentation experiments, a novel brittle-ductile mechanism of ultra-precision turning of single crystal silicon is proposed. The accurate critical chip thickness is firstly calculated on the basis of theoritical analysis. A macro-micro cutting model is created based on the brittle-ductile transition mechanism. Finally, the results of study are testified through experiments.

  Info
Periodical
Key Engineering Materials (Volumes 375-376)
Edited by
Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages
11-16
DOI
10.4028/www.scientific.net/KEM.375-376.11
Citation
M. H. Wang, Z. S. Lu, "Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon ", Key Engineering Materials, Vols. 375-376, pp. 11-16, 2008
Online since
March 2008
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Price
$32.00
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