Paper Title:
Research on Chemical Mechanical Polishing for Silicon Nitride Ceramics
  Abstract

Silicon nitride ceramics materials have excellent properties such as small density, high rigidity, high Young's modulus, high wearability, good thermal stability and chemical stability, which make it become one of the most appropriate materials for rollers of high precision bearing. Chemical Mechanical Polishing (CMP) technology is employed to have an ultra-precision machining process for silicon nitride ceramics materials workpiece and the effects of workpiece surface roughness in different abrasive are discussed in this research. The XRD and SEM technology are used to take phase analysis and surface profile detection for the finishing workpiece polished with CeO2 abrasive. The chemical reaction mechanism and the material remove mechanism of silicon nitride ceramics materials in CMP process with CeO2 abrasive are both analysed and discussed in this paper. The research result shows that an extremely smooth surface of silicon nitride ceramics materials workpiece with roughness 5nm Ra is obtained after CMP process with polyurethane polishing pad and CeO2 abrasive.

  Info
Periodical
Key Engineering Materials (Volumes 375-376)
Edited by
Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages
283-287
DOI
10.4028/www.scientific.net/KEM.375-376.283
Citation
C. R. Zhu, J. L. Yuan, Q. Xu, B. H. Lv, "Research on Chemical Mechanical Polishing for Silicon Nitride Ceramics", Key Engineering Materials, Vols. 375-376, pp. 283-287, 2008
Online since
March 2008
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Cong Rong Zhu, Bing Hai Lv, Ju Long Yuan
Abstract:Studies on chemical mechanical polishing (CMP) for silicon nitride (Si3N4) balls with CeO2 abrasive carried to investigate the mechanism of...
131
Authors: Suo Xian Yuan, Yun Xia Hao
Abstract:In recent years, the demands on product performance are improving, particularly in the aviation; electronics, precision instruments and other...
713
Authors: Qian Fa Deng, Ping Zhao, Bing Hai Lv, Ju Long Yuan, Zhi Wei Wang
Chapter 1: Grinding Technology
Abstract:Abrasive machining is an important process for the manufacturing of advanced ceramics. The demand for advanced ceramics with better quality...
251
Authors: Heng Zhen Dai, Zhu Ji Jin, Shang Gao, Z.C. Tao
Chapter 1: Grinding Technology
Abstract:Aiming at the severe surface/subsurface damage of Al2O3ceramic ground by diamond grinding wheel, the...
270
Authors: Jian Xiu Su, Jia Xi Du, Xing Long Liu, Hai Na Liu
Abstract:SiC crystal substrate has been widely used in the area of microelectronics, photonics and new materials, such as semiconductor lighting,...
250