Paper Title:
Effects of Conditioning Parameters on Pad Performances
  Abstract

This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO3 crystal wafers.

  Info
Periodical
Key Engineering Materials (Volumes 375-376)
Edited by
Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages
293-297
DOI
10.4028/www.scientific.net/KEM.375-376.293
Citation
X. Wei, H. Yuan, W. Xiong, X. Z. Xie, "Effects of Conditioning Parameters on Pad Performances", Key Engineering Materials, Vols. 375-376, pp. 293-297, 2008
Online since
March 2008
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