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Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application

Journal Key Engineering Materials (Volumes 375 - 376)
Volume Advances in Machining & Manufacturing Technology IX
Edited by Yingxue Yao, Xipeng Xu and Dunwen Zuo
Pages 47-51
DOI 10.4028/www.scientific.net/KEM.375-376.47
Citation Ji Jun Zhu et al., 2008, Key Engineering Materials, 375-376, 47
Online since March, 2008
Authors Ji Jun Zhu, Ju Long Yuan, Simon S. Ang
Keywords Application, LTCC, Micro-Fluidic, Polishing
Abstract

Multilayer ceramics based on the low-temperature co-fired ceramics (LTCC) are gaining increasing interests in the manufacturing of highly-integrated systems for microelectronic and micro-system applications. The polishing experiments of sintered LTCC using a custom-built precision polishing machine are reported in this paper. First, a micro-fluidic distributor was fabricated using LTCC. Then, the polishing of this meso-MEMS system was studied using several polishing parameters. By optimizing the polishing parameters, the surface roughness can be reduced to 4 nm.

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