Paper Title:
Development of a Flexible Temperature Sensor Array System
  Abstract

A flexible temperature sensor array and a scanning system are developed in this paper. A 16×16 temperature sensor array in a 25×20 mm2 area is fabricated on a flexible copper-PI substrate using MEMS fabrication technology. Platinum is employed as the temperature sensing material, which is often so called the resistance temperature detector (RTD). Copper patterns on both sides of the flexible substrate serve as the row and column interconnects for scanning circuitry. In each element of the temperature sensor array, the resistance of platinum, which is patterned by lift-off process, can be measured by the scanning system.

  Info
Periodical
Key Engineering Materials (Volumes 381-382)
Edited by
Wei Gao, Yasuhiro Takaya, Yongsheng Gao and Michael Krystek
Pages
383-386
DOI
10.4028/www.scientific.net/KEM.381-382.383
Citation
Y. J. Yang, B.T. Chia, D.R. Chang, H.H. Liao, W. P. Shih, F.Y. Chang, K. C. Fan, "Development of a Flexible Temperature Sensor Array System", Key Engineering Materials, Vols. 381-382, pp. 383-386, 2008
Online since
June 2008
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Price
$32.00
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