Paper Title:
The Thermoelectromechanical J-Integral and the Thermal Permeability of Cracks
  Abstract

The J-integral for cracks in structures storing elastic, dielectric and thermal energies is derived from thermodynamical fundamentals. The FEM is applied to solve thermoelectrome- chanical boundary value problems, accounting for piezoelectric coupling, thermoelasticity and the pyroelectric effect. Examples demonstrate the influence of the thermal conductivity of cracks on the loading of the crack tip.

  Info
Periodical
Key Engineering Materials (Volumes 385-387)
Edited by
H.S. Lee, I.S. Yoon and M.H. Aliabadi
Pages
569-572
DOI
10.4028/www.scientific.net/KEM.385-387.569
Citation
A. Ricoeur, M. Kuna, "The Thermoelectromechanical J-Integral and the Thermal Permeability of Cracks", Key Engineering Materials, Vols. 385-387, pp. 569-572, 2008
Online since
July 2008
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Price
$32.00
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