Paper Title:
Stress Singularity of Thermal Stresses in Three-Dimensional Bonded Structures with an Interlayer
  Abstract

In the present paper, singular stress field at the vertex on the interface in three-dimensional bonded joints is analyzed using BEM and eigen analysis. The order of stress singularity is determined solving an eigen equation based on FEM formulation and the stress distribution is expressed using the result of the eigen-value analysis. A relationship between the thickness of interlayer and residual thermal stresses is presented. Then, a three-dimensional intensity of singularity is determined.

  Info
Periodical
Key Engineering Materials (Volumes 385-387)
Edited by
H.S. Lee, I.S. Yoon and M.H. Aliabadi
Pages
573-576
DOI
10.4028/www.scientific.net/KEM.385-387.573
Citation
H. Koguchi, A. Taniguchi, "Stress Singularity of Thermal Stresses in Three-Dimensional Bonded Structures with an Interlayer", Key Engineering Materials, Vols. 385-387, pp. 573-576, 2008
Online since
July 2008
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Price
$32.00
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