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Advances in Abrasive Technology XI

Volumes 389 - 390
doi: 10.4028/www.scientific.net/KEM.389-390
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Preface

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone

Authors: Zhongde Shi, Madhusudhan Srinivasaraghavan, Helmi Attia

1

Study on the Subsurface Damage of Single Crystal MgO Substrates

Authors: Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia

7

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer

Authors: J. Sasaki, T. Tsuruga, B.H. Soltani, Takahito Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya

13

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

Authors: Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara

18

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

Authors: H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu

24

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool

Authors: Junichi Tamaki, Akihiko Kubo, Ji Wang Yan

30

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Authors: Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin

36

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