Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
187-192 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.187 |
| Online since |
September, 2008 |
| Authors |
Yong Bo Wu, Kunio Shimada |
| Keywords |
High Frequency Quartz Oscillator, Magnetic Compound Fluid (MCF), Material Removal, Polishing, Quartz Wafer, Surface Roughness, Thickness |
| Abstract |
This paper deals with the machining of quartz wafers using an MCF (Magnetic Compound
Fluid) polishing liquid, frozen with liquid nitrogen. This type of polishing liquid is composed of
water-based MF (Magnetic Fluid), iron powder, abrasive particle and α-cellulose, and consequently
reacting to magnetic fields. Experiments of polishing quartz wafers using the MCF method were
carried out on a previously developed apparatus. The results show that an MCF polishing liquid,
frozen with liquid nitrogen, has greater material removal capability than one that has not been frozen.
A frozen MCF polishing liquid containing larger abrasive particles yields a higher material removal
rate, however the surface roughness deteriorates. The highest material removal rate and the best
surface roughness were obtained when the percentage of water, in the frozen MCF polishing tool, was
34.7%. |
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