Paper Title:
Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film
  Abstract

This paper investigates two kinds of grinding wheels prepared by the combination of mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to characterize two kinds of grinding wheels and identify the removal mechanism. It was found that FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was removed by transformation diamond to non-diamond carbons and then removed by mechanically or diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond carbon and titanium.

  Info
Periodical
Key Engineering Materials (Volumes 389-390)
Edited by
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages
217-222
DOI
10.4028/www.scientific.net/KEM.389-390.217
Citation
Z. J. Jin, Z. W. Yuan, R. K. Kang, B.X. Dong, "Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film", Key Engineering Materials, Vols. 389-390, pp. 217-222, 2009
Online since
September 2008
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Price
$32.00
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