Study on Two Kinds of Grinding Wheels for Dynamic Friction
Polishing of CVD Diamond Film |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
217-222 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.217 |
| Online since |
September, 2008 |
| Authors |
Zhu Ji Jin, Ze Wei Yuan, Ren Ke Kang, B.X. Dong |
| Keywords |
CVD Diamond, Dynamic Friction Polishing, Grinding Wheel |
| Abstract |
This paper investigates two kinds of grinding wheels prepared by the combination of
mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical
microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to
characterize two kinds of grinding wheels and identify the removal mechanism. It was found that
FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless
carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was
removed by transformation diamond to non-diamond carbons and then removed by mechanically or
diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC
grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond
carbon and titanium. |
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