Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
36-41 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.36 |
| Online since |
September, 2008 |
| Authors |
Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin |
| Keywords |
Grain Protrusion Height, Grinding, Silicon Wafer, Static Effective Grain Density, Wheel Chatter, Wheel Elastic Deformation, Wheel Surface Topography |
| Abstract |
A 3D profiler based on scanning white light interferometry with a lateral sampling interval
of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel,
and a large sampling area could be achieved by its stitching capability without compromising its
lateral or vertical resolution. The protrusion height distribution of diamond grains and the static
effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation
of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an
approximate normal distribution, the static effective grain density is much lower than the theoretical
density, and only a small number of diamond grains are effective in the grinding process with fine
diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel
cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates
that the elastic deformation at the wheel edges is much larger than in the center region. |
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