Paper Title:
Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy
  Abstract

Warp accuracy and nanotopography in the silicon wafer slicing process influence the final quality of the wafer. Therefore, methods to improve these factors are important. And this will require the achievement of low costs and high quality processing – conflicting requirements – with larger sized wafers than in previous generations. The present study was performed to assess mechanical factors, such as machine static accuracy and thermal deformation, to improve the accuracy of multi-wire saws. This report deals with the influence of thermal deformation of the ingot and wire guides upon processing accuracy, and describes the assessment results.

  Info
Periodical
Key Engineering Materials (Volumes 389-390)
Edited by
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages
442-447
DOI
10.4028/www.scientific.net/KEM.389-390.442
Citation
Y. Abe, K. I. Ishikawa, H. Suwabe, "Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy ", Key Engineering Materials, Vols. 389-390, pp. 442-447, 2009
Online since
September 2008
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Price
$32.00
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