Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides
and Ingot on Slicing Accuracy
|
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
442-447 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.442 |
| Online since |
September, 2008 |
| Authors |
Yoshinori Abe, Ken-Ichi Ishikawa, Hitoshi Suwabe |
| Keywords |
Multi-Wire Saw, Nanotopography, Silicon Wafer, Slicing |
| Abstract |
Warp accuracy and nanotopography in the silicon wafer slicing process influence the final
quality of the wafer. Therefore, methods to improve these factors are important. And this will require
the achievement of low costs and high quality processing – conflicting requirements – with larger
sized wafers than in previous generations. The present study was performed to assess mechanical
factors, such as machine static accuracy and thermal deformation, to improve the accuracy of
multi-wire saws. This report deals with the influence of thermal deformation of the ingot and wire
guides upon processing accuracy, and describes the assessment results. |
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