Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy |
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| Journal | Key Engineering Materials (Volumes 389 - 390) |
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| Volume | Advances in Abrasive Technology XI |
| Edited by | Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages | 442-447 |
| DOI | 10.4028/www.scientific.net/KEM.389-390.442 |
| Citation | Yoshinori Abe et al., 2008, Key Engineering Materials, 389-390, 442 |
| Online since | September, 2008 |
| Authors | Yoshinori Abe, Ken-Ichi Ishikawa, Hitoshi Suwabe |
| Keywords | Multi-Wire Saw, Nanotopography, Silicon Wafer, Slicing |
| Abstract | Warp accuracy and nanotopography in the silicon wafer slicing process influence the final quality of the wafer. Therefore, methods to improve these factors are important. And this will require the achievement of low costs and high quality processing – conflicting requirements – with larger sized wafers than in previous generations. The present study was performed to assess mechanical factors, such as machine static accuracy and thermal deformation, to improve the accuracy of multi-wire saws. This report deals with the influence of thermal deformation of the ingot and wire guides upon processing accuracy, and describes the assessment results. |
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