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Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding

Journal Key Engineering Materials (Volumes 389 - 390)
Volume Advances in Abrasive Technology XI
Edited by Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages 465-468
DOI 10.4028/www.scientific.net/KEM.389-390.465
Online since September, 2008
Authors Han Huang, Y.Q. Wu, Y. Wang, Jin Zou, Li Bo Zhou
Keywords Nanogrinding, Nanoscratch, Removal Mechanism, Silicon, Subsurface Damage
Abstract This paper reports the effect of nanogrinding conditions on the formation of subsurface structures of monocrystalline silicon (100) substrates. It was found that the amorphization and the transformation of high pressure phases were related to the grit depth of cut employed in nanogrinding. The formation mechanisms were found to be different from those previously reported from the nanoindentation studies.
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