Study on the CMP Pad Life with its Mechanical Properties |
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| Journal | Key Engineering Materials (Volumes 389 - 390) |
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| Volume | Advances in Abrasive Technology XI |
| Edited by | Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages | 481-486 |
| DOI | 10.4028/www.scientific.net/KEM.389-390.481 |
| Citation | Pei Lum Tso et al., 2008, Key Engineering Materials, 389-390, 481 |
| Online since | September, 2008 |
| Authors | Pei Lum Tso, Zhe Hao Huang, Sheng Wei Chou, Cheng Yi Shih |
| Keywords | Chemical Mechanical Polishing (CMP), Cost of Consumable, Pad Conditioning |
| Abstract | The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and the slurry. The polishing pad significantly influences the stability of the polishing process and the cost of consumables (CoC). During the polishing process, a diamond dresser must be frequently employed to remove the debris to prevent accumulation, a process known as pad conditioning. In this paper, we investigated the physical properties of the CMP pad such as compressibility, thickness, and surface roughness. The difference between new and used pads has been studied. Conclusively, conditioning via a diamond dresser will extend pad life and reduce CoC. |
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