Paper Title:
Study on the CMP Pad Life with its Mechanical Properties
  Abstract

The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and the slurry. The polishing pad significantly influences the stability of the polishing process and the cost of consumables (CoC). During the polishing process, a diamond dresser must be frequently employed to remove the debris to prevent accumulation, a process known as pad conditioning. In this paper, we investigated the physical properties of the CMP pad such as compressibility, thickness, and surface roughness. The difference between new and used pads has been studied. Conclusively, conditioning via a diamond dresser will extend pad life and reduce CoC.

  Info
Periodical
Key Engineering Materials (Volumes 389-390)
Edited by
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages
481-486
DOI
10.4028/www.scientific.net/KEM.389-390.481
Citation
P. L. Tso, Z. H. Huang, S. W. Chou, C. Y. Shih, "Study on the CMP Pad Life with its Mechanical Properties", Key Engineering Materials, Vols. 389-390, pp. 481-486, 2009
Online since
September 2008
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Price
$32.00
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