A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
493-497 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.493 |
| Online since |
September, 2008 |
| Authors |
Sung Chul Hwang, Jong Koo Won, Jung Taik Lee, Eun Sang Lee |
| Keywords |
Box-Behnken Method, Final Polishing Processing, Regression Analysis, Si Wafer, Surface Roughness |
| Abstract |
As the level of Si-wafer surface directly affects device line-width capability, process
latitude, yield, and throughput in fabrication of microchips, it needs to have ultra precision
surface and flatness. Polishing is one of the important processing having influence on the
surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is
mainly affected by the many process parameters. For decreasing the surface roughness, the
control of polishing parameters is very important. In this paper, the optimum condition selection
of ultra precision wafer polishing and the effect of polishing parameters on the surface
roughness were evaluated by the statistical analysis of the process parameters. |
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