Paper Title:
A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition
  Abstract

As the level of Si-wafer surface directly affects device line-width capability, process latitude, yield, and throughput in fabrication of microchips, it needs to have ultra precision surface and flatness. Polishing is one of the important processing having influence on the surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is mainly affected by the many process parameters. For decreasing the surface roughness, the control of polishing parameters is very important. In this paper, the optimum condition selection of ultra precision wafer polishing and the effect of polishing parameters on the surface roughness were evaluated by the statistical analysis of the process parameters.

  Info
Periodical
Key Engineering Materials (Volumes 389-390)
Edited by
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages
493-497
DOI
10.4028/www.scientific.net/KEM.389-390.493
Citation
S. C. Hwang, J. K. Won, J. T. Lee, E. S. Lee, "A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition", Key Engineering Materials, Vols. 389-390, pp. 493-497, 2009
Online since
September 2008
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Price
$32.00
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