Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing
Pad in Chemical Mechanical Planarization |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
498-503 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.498 |
| Online since |
September, 2008 |
| Authors |
N. Qin, Dong Ming Guo, Ren Ke Kang, Feng Wei Huo |
| Keywords |
Conditioner, Non-Uniformity, Polishing Pad, Rotation Direction, Rotation Speed, Speed Ratio |
| Abstract |
The calculating model of surface non-uniformity of polishing pad and the kinematical
model between polishing pad and conditioner are initially established. Then the effects of several
conditioning parameters were investigated by using the two models. The results of simulation and
calculation show that the width ratio of diamond band of conditoner and the rotation speed at the same
speed ratio between pad and conditioner have little effect on the surface non-uniformity of polishing
pad, while at high non-integer rotation speed ratio, the surface non-uniformity of polishing pad is
better than that at low integer speed ratio. The research results are available to select appropriate
conditioning parameters especially for the stringent requirement of within-wafer non-uniformity in
next generation IC. |
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