Paper Title:
Effect of Polishing Time and Pressure on Polishing Pad Performance
  Abstract

This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced.

  Info
Periodical
Key Engineering Materials (Volumes 389-390)
Edited by
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Pages
510-514
DOI
10.4028/www.scientific.net/KEM.389-390.510
Citation
A.Q. Biddut, L. C. Zhang, Y.M. Ali, "Effect of Polishing Time and Pressure on Polishing Pad Performance", Key Engineering Materials, Vols. 389-390, pp. 510-514, 2009
Online since
September 2008
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Price
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