Effect of Polishing Time and Pressure on Polishing Pad Performance |
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| Journal | Key Engineering Materials (Volumes 389 - 390) |
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| Volume | Advances in Abrasive Technology XI |
| Edited by | Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages | 510-514 |
| DOI | 10.4028/www.scientific.net/KEM.389-390.510 |
| Citation | A.Q. Biddut et al., 2008, Key Engineering Materials, 389-390, 510 |
| Online since | September, 2008 |
| Authors | A.Q. Biddut, Liang Chi Zhang, Y.M. Ali |
| Keywords | Abrasive, Polishing, Silicon |
| Abstract | This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced. |
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