Experimental Trial of Fullerene Wheel Fabrication |
| Journal |
Key Engineering Materials (Volumes 389 - 390) |
| Volume |
Advances in Abrasive Technology XI |
| Edited by |
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara |
| Pages |
61-66 |
| DOI |
10.4028/www.scientific.net/KEM.389-390.61 |
| Online since |
September, 2008 |
| Authors |
Takeshi Tanaka |
| Keywords |
Fullerene, Metal-Bonded Wheel, Polishing, Silicon Wafer |
| Abstract |
The purpose of this study is to fabricate a wheel using fullerenes with nano-scaled particles, and to
investigate the polishing performance of fullerene wheel. A super smooth surface was formed on a silicon wafer
by polishing the wafer with metal-bonded diamond wheels using a diamond abrasive grit of 0-0.125 μm and
fullerenes with a diameter of 0.7 nm. We used two kinds of metal-bonded diamond wheels for pre-polishing
and a metal-bonded fullerene wheel for the finishing process. Though the surface roughness after polishing with
the fullerene wheel was almost equal to that obtained by polishing with the metal-bonded diamond wheel using
diamond abrasive grit of 0-0.125 μm, the chemical-mechanical polishing process was clarified by AFM
(atomic force microscope) observation when we used a metal-bonded fullerene wheel with 5wt% KOH
(potassium hydroxide) solution. The greater number of smoothed portions on the surface of the silicon wafer
indicated that the fullerenes provided the same polishing ability as that of the abrasive grit. |
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