Paper Title
Page
Authors: Han Huang, Y.Q. Wu, Y. Wang, Jin Zou, Li Bo Zhou
Abstract:This paper reports the effect of nanogrinding conditions on the formation of subsurface structures of monocrystalline silicon (100)...
465
Authors: Ji Wang Yan, Tooru Asami, Tsunemoto Kuriyagawa
Abstract:Ultraprecision diamond-cut silicon wafers were irradiated by a nanosecond pulsed Nd:YAG laser, and the resulting specimens were...
469
Authors: Dong Ming Guo, Rui Hong Liu, Ren Ke Kang, Zhu Ji Jin
Abstract:In the process of CMP SiO2 ILD, the nano-particle with high surface energy in slurry has an essential impact on the efficiency and quality...
475
Authors: Pei Lum Tso, Zhe Hao Huang, Sheng Wei Chou, Cheng Yi Shih
Abstract:The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and the slurry. The polishing pad significantly...
481
Authors: Pei Lum Tso, Cheng Yi Shih
Abstract:A mechanical polishing process was used to reduce surface roughness through mechanical fracturing and removal of the substrate’s roughened...
487
Authors: Sung Chul Hwang, Jong Koo Won, Jung Taik Lee, Eun Sang Lee
Abstract:As the level of Si-wafer surface directly affects device line-width capability, process latitude, yield, and throughput in fabrication of...
493
Authors: N. Qin, Dong Ming Guo, Ren Ke Kang, Feng Wei Huo
Abstract:The calculating model of surface non-uniformity of polishing pad and the kinematical model between polishing pad and conditioner are...
498
Authors: A.Q. Biddut, Liang Chi Zhang, Y.M. Ali, Zong Wen Liu
Abstract:This paper experimentally investigates the micro-structural changes in mono-crystalline silicon induced by abrasive polishing with abrasive...
504
Authors: A.Q. Biddut, Liang Chi Zhang, Y.M. Ali
Abstract:This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate...
510
Authors: Ryunosuke Sato, Yoshio Ichida, Yoshitaka Morimoto, Kenji Shimizu
Abstract:A series of polishing experiments have been carried out using Mn2O3 as abrasive grains to examine the polishing characteristics of CMP for...
515
Showing 81 to 90 of 91 Paper Titles