Paper Title:
Study for Laser Cladding of Ni60A on Copper Substrate by Laser
  Abstract

The Ni60A powder was clad on the copper by the laser through coaxial power feeding. The hardness and erosion resistance of the substrate and the cladding layer were measured and made contrasts. The morphology and the microstructures of the cladding layer were analyzed by scanning electronic microscopy as well as the microstructure of bonding interface. The contents of major elements in the bonding interface were studied by energy dispersive spectrometer. Moreover, large amount of (Cu and Ni) solid solution formed a metallurgic and tight bonding with the good dilution between the substrate and cladding layer.

  Info
Periodical
Key Engineering Materials (Volumes 392-394)
Edited by
Guanglin Wang, Huifeng Wang and Jun Liu
Pages
125-130
DOI
10.4028/www.scientific.net/KEM.392-394.125
Citation
F. J. Tian, W. J. Liu, X. F. Shang, G. Yang, "Study for Laser Cladding of Ni60A on Copper Substrate by Laser", Key Engineering Materials, Vols. 392-394, pp. 125-130, 2009
Online since
October 2008
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