Paper Title:
Thinning Silicon Wafer with Polycrystalline Diamond Tools
  Abstract

Sintered polycrystalline diamond (PCD) compacts are normally used for cutting tools, drill bits and wire dies. A novel application of PCD has been developed to use its entire surface carved to create different patterns which are triangle or square shape loaded with leveled millers that can shave brittle materials in ductile mode. Due to numerous cutting edges formed on the same level of PCD tools, which can be used to thin the wafer surface to achieve both flatness and smoothness of the industrial requirements. SEM has been used to observe the surface and subsurface of the thinned wafer surface. The critical depth of cut between ductile and brittle cutting mode is close to 2 µm in this thinning operation. The damaged layers of machined surface have been observed and studied in this paper.

  Info
Periodical
Edited by
Xipeng Xu
Pages
157-163
DOI
10.4028/www.scientific.net/KEM.404.157
Citation
P. L. Tso, C. H. Chen, "Thinning Silicon Wafer with Polycrystalline Diamond Tools", Key Engineering Materials, Vol. 404, pp. 157-163, 2009
Online since
January 2009
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$35.00
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