Paper Title:
Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review
  Abstract

Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving a high degree of parallelism and flatness of wafer surfaces. This paper reviews the literature on lapping of substrate wafers. It presents reported experimental results on effects of input parameters (lapping pressure, plate rotation speed, abrasive grain size, slurry concentration, and slurry flow rate) on material removal rate and surface roughness.

  Info
Periodical
Edited by
Xipeng Xu
Pages
23-31
DOI
10.4028/www.scientific.net/KEM.404.23
Citation
W. L. Cong, P. F. Zhang, Z. J. Pei, "Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review", Key Engineering Materials, Vol. 404, pp. 23-31, 2009
Online since
January 2009
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