Paper Title:
Material Removal Model of Sapphire Substrate in Double-Side Lapping Process
  Abstract

The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.

  Info
Periodical
Key Engineering Materials (Volumes 407-408)
Edited by
Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko
Pages
460-464
DOI
10.4028/www.scientific.net/KEM.407-408.460
Citation
C. D. Lu, D. M. Qian, S. F. Jiang, "Material Removal Model of Sapphire Substrate in Double-Side Lapping Process", Key Engineering Materials, Vols. 407-408, pp. 460-464, 2009
Online since
February 2009
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Price
$32.00
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