Paper Title:
The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon
  Abstract

. In this paper, the model of fixed abrasive diamond wire saw has been set up, and its cutting mechanism has been discussed. Then, the material removal rate model and wire saw cutting efficiency model have been established. the speed of wire saw, the number of the dynamic effective abrasive and the workpiece feed rate have been analyzed to study their impaction on the stability of cutting process. Finally, some rules and suggestions were brought forward.

  Info
Periodical
Key Engineering Materials (Volumes 407-408)
Edited by
Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko
Pages
684-689
DOI
10.4028/www.scientific.net/KEM.407-408.684
Citation
L. G. Zhao, D. W. Zuo, Y. L. Sun, M. Wang, "The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon ", Key Engineering Materials, Vols. 407-408, pp. 684-689, 2009
Online since
February 2009
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Price
$32.00
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