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Advances in Grinding and Abrasive Technology XV

Key Engineering Materials Volume 416

• Papers
• Abstracts

• p-1 Preface   [ 18 K ]
• p0 Conference Organizers   [ 24 K ]
• p1 The Effect of the Magnetic Field’s Direction to Polishing in a Magnetic-Electrochemical Compound Polishing   [ 161 K ]
  Authors: Li Min Shi, Yong Jiang Niu, Er Liang Liu, Yong Feng Ma
• p8 Belt Grinding of TC4 Based on the Technology of Cryogenic Mist Jet Combined MQL   [ 147 K ]
  Authors: Yu Fu Wang, Yun Huang, Zhi Huang, Liang Yi
• p13 Experimental Study on Point Grinding Technical Parameters Affecting Coolant Jet Parameters   [ 189 K ]
  Authors: Shi Chao Xiu, Zhi Jie Geng, Peng Bo Xiu
• p18 Experimental Study on Ultra-Precision ELID Grinding for Concave Spherical Surface of Carbide   [ 517 K ]
  Authors: Fu Qiang Tong, Yong Zhang, Fei Hu Zhang
• p23 Studies on the Grinding Properties of Ultrasonic Assisted Creep Feed Grinding Using Grinding Wheel with Small Diameter   [ 171 K ]
  Authors: Jian Xin Zheng, Jia Wen Xu, Chuan Shao Liu
• p28 Temperature Field during CMP GaAs Wafer Using an AID   [ 611 K ]
  Authors: Wen Zhuang Lu, Dun Wen Zuo, Yu Li Sun, Yu Fei Zhao, Feng Xu, Rong Fa Chen
• p34 Design and Research of Embedded Internal Grinding NC System Based on μC/OS-II   [ 286 K ]
  Authors: Ou Xie, Hua Li, Yan Li
• p40 Experimental Study on High Efficiency Grinding Technology for Irregular Surface of Q.L. Red Granite   [ 151 K ]
  Authors: Zheng Mei Zhang, Jin Sheng Zhang, Zhi Wang, Chun Ying Zheng
• p45 Fatigue Life Variance Prediction Incorporating Residual Stress Scatter Induced by Super-Finishing Grinding Process   [ 1 M ]
  Authors: Guang Hui Lu, Xue Ping Zhang, Er Wei Gao
• p51 Analysis of Grinding Force Influence on HIPSN Ceramic Grinding Surface   [ 177 K ]
  Authors: Ke Zhang, He Wang, Yu Hou Wu, Song Hua Li
• p54 Study on the Rheological Effect Models of Fluid Magnetic Abrasive   [ 390 K ]
  Authors: Huan Wu Sun, Shi Chun Yang
• p61 Study on Precision Measuring Method of Reloading Machine Tool   [ 260 K ]
  Authors: Wang Shen Hao, Jie Han, Wei Hao, Bo Zhao
• p66 Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers   [ 372 K ]
  Authors: Yin Xia Zhang, Jian Xiu Su, Wei Gao, Ren Ke Kang