Paper Title:
Development of Resin Bonded Diamond Wire Saw and Slicing Experiments
  Abstract

Because its advantages of lower manufacture cost and higher slicing quality, the resin bonded diamond wire saw is supposed to be used widely in the future for slicing hard-brittle materials such as silicon crystal. In this paper, based on the research of the resin bonded diamond wire saw manufacturing technology and slicing process, we select Φ0.2mm SWPB piano string as core wire, 20-30m (800#) diamond grain as abrasive, liquid phenolic resin mixed with epoxy resin as adhesive, the nanometer powders as additive to improve the adhesive holding strength of abrasive grains and heat resistance. By orthogonal experiment, we find the resin bonded diamond wire saw has optimizing performance as the additives is 10% in adhesive, the epoxy resin is 30% in resin, the diamond is 50% in whole mixed material. Slicing experiments proves that the resin bonded diamond wire saw manufactured in this study has better slicing performance. The failure forms of the resin bonded diamond wire saw are wear out of resin adhesive, falling off of diamond grains and the partial peeling off of the resin bond.

  Info
Periodical
Edited by
Bo Zhao, Xipeng Xu, Guangqi Cai and Renke Kang
Pages
321-326
DOI
10.4028/www.scientific.net/KEM.416.321
Citation
P. Q. Ge, Z. J. Hou, S. J. Li, "Development of Resin Bonded Diamond Wire Saw and Slicing Experiments ", Key Engineering Materials, Vol. 416, pp. 321-326, 2009
Online since
September 2009
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Price
$32.00
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