Advances in Grinding and Abrasive Technology XV
| Paper Title | Page |
|---|---|
|
Authors: Guang Hui Lu, Xue Ping Zhang, Er Wei Gao |
45 |
|
Analysis of Grinding Force Influence on HIPSN Ceramic Grinding Surface Authors: Ke Zhang, He Wang, Yu Hou Wu, Song Hua Li |
51 |
|
Study on the Rheological Effect Models of Fluid Magnetic Abrasive Authors: Huan Wu Sun, Shi Chun Yang |
54 |
|
Study on Precision Measuring Method of Reloading Machine Tool Authors: Wang Shen Hao, Jie Han, Wei Hao, Bo Zhao |
61 |
|
Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers Authors: Yin Xia Zhang, Jian Xiu Su, Wei Gao, Ren Ke Kang |
66 |
|
Authors: Zhen Zhong Wang, Yin Biao Guo, Jiang Guo, Qiao Xu |
71 |
|
Research on Wheel Wear in HIPSN Bearing Ring High Speed Grinding Authors: He Wang, Yu Hou Wu, Ke Zhang, Song Hua Li |
77 |
|
Research on Technology of Pulse Electrochemical and its Compound Finishing Authors: Hong You Li, Yin Biao Guo, Xiao Mei Liu, Jin Jin Zhou |
82 |
|
Simulation of Compacting Process for Semi-Fixed Abrasive Wheel Authors: Bing Hai Lv, Ju Long Yuan, Zhi Wei Wang |
87 |
|
Research on NC Grinding Accessories of Isometric Polygonal Profile Authors: De Sheng Wang, Ai Ping Zhou, Yong Jun Zhao |
93 |