Paper Title:
Dynamic Analysis of Wafer Slicing by Using Multi Wire Saw
  Abstract

Multi wire saw is the important basis of integrate circuit, optoelectronic, photovoltaic industry, and it becomes a promising technology for semiconductor wafer production because of its advantage of slicing large ingot into thin wafers with high efficiency and good quality. In the process of moving, the inevitable wiresaw vibration is directly related to the whole process with both benefit and harm. This paper analyses the wire vibration behavior in cutting area, the dynamic model is built by modeling the interaction between the dynamics of wire and hydrodynamic characteristics of slurry flow, available modal analysis provides closed form expressions for the steady state response, obtain the vibration of wire subject to different process parameters on wire saw manufacturing process.

  Info
Periodical
Key Engineering Materials (Volumes 419-420)
Edited by
Daizhong Su, Qingbin Zhang and Shifan Zhu
Pages
421-424
DOI
10.4028/www.scientific.net/KEM.419-420.421
Citation
Y. B. Feng, T. Sun, "Dynamic Analysis of Wafer Slicing by Using Multi Wire Saw", Key Engineering Materials, Vols. 419-420, pp. 421-424, 2010
Online since
October 2009
Authors
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Price
$32.00
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