Paper Title:
Grain Size Strengthening in Microcrystalline Copper: A Three-Dimensional Dislocation Dynamics Simulation
  Abstract

This article reports on a study of the microstructure and mechanical response of copper polycrystals with grain sizes in the micrometer range. Three-dimensional dislocation dynamics simulations are used for the first time to investigate grain boundary strengthening and the Hall-Petch law. The methodology, which involves constructing a microcrystalline representative volume element with periodic boundary conditions, is briefly presented. Simulation results show that the initial density of dislocation sources and the cross-slip mechanism are two key factors controlling the heterogeneity of plastic deformation within the grains. At yield, the smaller the grains size, the more plastic deformation is heterogeneously distributed between grains and homogeneously distributed inside the grains. A size effect is reproduced and it is shown that the Hall-Petch exponent decreases from the very beginning of plastic flow and may reach a stable value at strains larger than the conventional proof stress.

  Info
Periodical
Edited by
Nicolás de la Rosa Fox
Pages
25-32
DOI
10.4028/www.scientific.net/KEM.423.25
Citation
C. de Sansal, B. Devincre, L. P. Kubin, "Grain Size Strengthening in Microcrystalline Copper: A Three-Dimensional Dislocation Dynamics Simulation", Key Engineering Materials, Vol. 423, pp. 25-32, 2010
Online since
December 2009
Export
Price
$35.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Chang Liang Li, Hua Ding, Yong Qing Zhao, Lian Zhou
Abstract:Superplastic forming provides a good way for Ti alloys which are usually difficult to be deformed. Ti75 alloy with a nominal composition of...
2969
Authors: Zhi Guo Chen, Zi Qiao Zheng, Dong Feng Han
Abstract:The hot deformation behaviors and microstructure in Al-Cu-Li alloy containing small amount of Ag and Mg were investigated by transmission...
1925
Authors: Gui Qing Chen, Gao Sheng Fu, Wen Duan Yan, Chao Zeng Cheng, Ze Chang Zou
Modeling, Analysis and Simulation of Manufacturing Processes
Abstract:The 3003 Al alloy was deformed by isothermal compression in the range of deformation temperature 300-500 °C at strain rate 0.0l-10.0...
306
Authors: Xiao Yu Zhong, Guang Jie Huang, Fang Fang He, Qing Liu
Abstract:Uni-axial tensile plastic deformation behavior of rolled magnesium alloy AZ31B under the temperature range from room temperature(RT) to 250°C...
219
Authors: Wojciech Wajda, Henryk Paul
Abstract:The paper describes the mechanism of deformation at 77 K of pure aluminum bicrystals of different grain orientations. The following...
108