Paper Title:
Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE
  Abstract

In the paper, C-Mold software was applied to the analysis of injecting molding of the notebook computer housing so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, the problem has been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.

  Info
Periodical
Key Engineering Materials (Volumes 426-427)
Edited by
Dunwen Zuo, Hun Guo, Guoxing Tang, Weidong Jin, Chunjie Liu and Chun Su
Pages
568-571
DOI
10.4028/www.scientific.net/KEM.426-427.568
Citation
B. Liu, X.J. Liu, L. Liao, Y.B. Du, "Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE", Key Engineering Materials, Vols. 426-427, pp. 568-571, 2010
Online since
January 2010
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Price
$32.00
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