FEM Simulation on the Temperature Distribution of Ice Fixed Abrasives Polishing |
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| Journal | Key Engineering Materials (Volumes 431 - 432) |
|---|---|
| Volume | Machining and Advanced Manufacturing Technology X |
| Edited by | Yingxue Yao, Dunwen Zuo and Xipeng Xu |
| Pages | 1-4 |
| DOI | 10.4028/www.scientific.net/KEM.431-432.1 |
| Citation | Yu Li Sun et al., 2010, Key Engineering Materials, 431-432, 1 |
| Online since | March, 2010 |
| Authors | Yu Li Sun, Dun Wen Zuo, Wen Zhuang Lu, Yu Fei Zhao, Jing Kang, Min Wang |
| Keywords | Finite Element Model (FEM), Ice Fixed Abrasive, Polishing, Single Silicon Wafer, Temperature Distribution |
| Abstract | The key question in the ice fixed abrasives (IFA) polishing is how to keep suitable ambient temperature in production process in order to avoid premature failure of the IFA. Based on above, the three dimensions finite element analysis (FEA) model of IFA polishing temperature field is built up at first. Then, the model reliability is demonstrated by experiments. Effects of ambient temperature and polishing time on temperature distribution and melting rate of the IFA pad are researched. The results show that the ambient temperature should be kept at about 10 ÂșC in order to control the melting rate of the IFA pad effectively and keep longer polishing time. All the results provide the basis for choosing suitable ambient temperature in polishing. |
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