Paper Title:
Study on Strengthening Mechanism of Microscale Laser Shock Peening
  Abstract

Microscale laser shock peening (μLSP) is a novel surface treating technology which oriented to microscale metal components in MEMS. Beneficial compressive residual stress is induced at the shocked region to improve the performance of microstructure based on wave-solid interactions. In this paper, the basic principle of μLSP and mechanism of wave-solid coupling were introduced, the influence factors on strengthening effects, such as micro-size effect, anisotropy, dislocation, stacking fault, grain boundary and surface energy were discussed from the microscopic point of view, the results provide theoretical guidance for further study.

  Info
Periodical
Key Engineering Materials (Volumes 431-432)
Edited by
Yingxue Yao, Dunwen Zuo and Xipeng Xu
Pages
221-224
DOI
10.4028/www.scientific.net/KEM.431-432.221
Citation
Y. J. Fan, J. Z. Zhou, S. Huang, M. Wang, Y. B. Zhu, L. L. Hu, J. F. Zhao, "Study on Strengthening Mechanism of Microscale Laser Shock Peening", Key Engineering Materials, Vols. 431-432, pp. 221-224, 2010
Online since
March 2010
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Price
$32.00
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