Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw |
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| Journal | Key Engineering Materials (Volumes 431 - 432) |
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| Volume | Machining and Advanced Manufacturing Technology X |
| Edited by | Yingxue Yao, Dunwen Zuo and Xipeng Xu |
| Pages | 25-28 |
| DOI | 10.4028/www.scientific.net/KEM.431-432.25 |
| Citation | Li Gang Zhao et al., 2010, Key Engineering Materials, 431-432, 25 |
| Online since | March, 2010 |
| Authors | Li Gang Zhao, Dun Wen Zuo, Yu Li Sun, Min Wang |
| Keywords | Fixed Diamond Wire Saw, Silicon Wafer |
| Abstract | The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed. |
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