Paper Title:
Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw
  Abstract

The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

  Info
Periodical
Key Engineering Materials (Volumes 431-432)
Edited by
Yingxue Yao, Dunwen Zuo and Xipeng Xu
Pages
25-28
DOI
10.4028/www.scientific.net/KEM.431-432.25
Citation
L. G. Zhao, D. W. Zuo, Y. L. Sun, M. Wang, "Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw", Key Engineering Materials, Vols. 431-432, pp. 25-28, 2010
Online since
March 2010
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Price
$32.00
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