Paper Title:
Modeling of Polishing Pad Wear in Chemical Mechanical Polishing
  Abstract

The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.

  Info
Periodical
Key Engineering Materials (Volumes 431-432)
Edited by
Yingxue Yao, Dunwen Zuo and Xipeng Xu
Pages
318-321
DOI
10.4028/www.scientific.net/KEM.431-432.318
Citation
M. Li, Y. W. Zhu, J. Li, K. Lin, "Modeling of Polishing Pad Wear in Chemical Mechanical Polishing", Key Engineering Materials, Vols. 431-432, pp. 318-321, 2010
Online since
March 2010
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Price
$32.00
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