Modeling of Polishing Pad Wear in Chemical Mechanical Polishing |
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| Journal | Key Engineering Materials (Volumes 431 - 432) |
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| Volume | Machining and Advanced Manufacturing Technology X |
| Edited by | Yingxue Yao, Dunwen Zuo and Xipeng Xu |
| Pages | 318-321 |
| DOI | 10.4028/www.scientific.net/KEM.431-432.318 |
| Citation | Mao Li et al., 2010, Key Engineering Materials, 431-432, 318 |
| Online since | March, 2010 |
| Authors | Mao Li, Yong Wei Zhu, Jun Li, Kui Lin |
| Keywords | CMP, Polishing Pad, Trajectory Density, Wear |
| Abstract | The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed. |
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