Paper Title:
Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding Using Monolayer Brazed Diamond Wheel
  Abstract

A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (hm) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when hm is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when hm is above the critical value.

  Info
Periodical
Key Engineering Materials (Volumes 431-432)
Edited by
Yingxue Yao, Dunwen Zuo and Xipeng Xu
Pages
326-329
DOI
10.4028/www.scientific.net/KEM.431-432.326
Citation
S. S. Li, J. H. Xu, Y. C. Fu, H. H. Su, "Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding Using Monolayer Brazed Diamond Wheel", Key Engineering Materials, Vols. 431-432, pp. 326-329, 2010
Online since
March 2010
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$32.00
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